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Semiconductor Thermal Data: MOSFET

TO-247#800#16 to TO-263 D2PAK#60#85

Thermal resistance and power dissipation data for semiconductor power devices — MOSFETs, IGBTs, SiC MOSFETs, GaN HEMTs, power diodes, Schottky diodes, and thyristor/SCRs. Covers TO-220, TO-247, TO-263 D2PAK, TO-252 DPAK, SO-8, QFN, and 62mm/34mm power module packages. Each record includes junction-to-case (Rth_jc), case-to-sink (Rth_cs), and junction-to-ambient (Rth_ja) thermal resistances, maximum junction temperature, power dissipation, switching loss, on-resistance or Vce_sat/Vf, and voltage/current ratings. 49 records across 7 device categories.

Mechanical Engineeringdevice type: MOSFET3 rowsPage 2 of 2
device typedevice keyRth cs C per W (degC/W)Rth ja C per W (degC/W)Rth jc C per W (degC/W)Tj max C (degC)current rating A (A)on resistance mOhm (mOhm)package typepower dissipation max W (W)voltage rating V (V)
MOSFETTO-247#800#160.1400.51501690TO-247210800
MOSFETTO-252 DPAK#30#300.5803.5175306TO-252 DPAK2930
MOSFETTO-263 D2PAK#60#850.5502175855.5TO-263 D2PAK5060

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