Semiconductor Thermal Data: IGBT

Thermal resistance and power dissipation data for semiconductor power devices — MOSFETs, IGBTs, SiC MOSFETs, GaN HEMTs, power diodes, Schottky diodes, and thyristor/SCRs. Covers TO-220, TO-247, TO-263 D2PAK, TO-252 DPAK, SO-8, QFN, and 62mm/34mm power module packages. Each record includes junction-to-case (Rth_jc), case-to-sink (Rth_cs), and junction-to-ambient (Rth_ja) thermal resistances, maximum junction temperature, power dissipation, switching loss, on-resistance or Vce_sat/Vf, and voltage/current ratings. 49 records across 7 device categories.

Mechanical Engineeringdevice_type: IGBT3 rows
device typedevice keyRth cs C per W (degC/W)Rth ja C per W (degC/W)Rth jc C per W (degC/W)Tj max C (degC)Vf V (V)current rating A (A)notespackage typepower dissipation max W (W)switching loss typical mJ (mJ)voltage rating V (V)
IGBTTO-220#600#150.5602150215600V/15A IGBT TO-220; Vce_sat at Ic=15A Tj=25C; Esw at 300V 15ATO-220750.15600
IGBTTO-220#600#250.5601.41501.925600V/25A IGBT TO-220; e.g. IRG4BC20KD class; standard trench field stopTO-2201070.25600
IGBTTO-247#1200#400.1400.451502.7401200V/40A IGBT TO-247; Vce_sat at Tj=125C; higher conduction loss than 600VTO-2473331.51,200

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