Semiconductor Thermal Data: SiC_MOSFET

Thermal resistance and power dissipation data for semiconductor power devices — MOSFETs, IGBTs, SiC MOSFETs, GaN HEMTs, power diodes, Schottky diodes, and thyristor/SCRs. Covers TO-220, TO-247, TO-263 D2PAK, TO-252 DPAK, SO-8, QFN, and 62mm/34mm power module packages. Each record includes junction-to-case (Rth_jc), case-to-sink (Rth_cs), and junction-to-ambient (Rth_ja) thermal resistances, maximum junction temperature, power dissipation, switching loss, on-resistance or Vce_sat/Vf, and voltage/current ratings. 49 records across 7 device categories.

Mechanical Engineeringdevice_type: SiC_MOSFET3 rows
device typedevice keyRth cs C per W (degC/W)Rth ja C per W (degC/W)Rth jc C per W (degC/W)Tj max C (degC)current rating A (A)noteson resistance mOhm (mOhm)package typepower dissipation max W (W)voltage rating V (V)
SiC_MOSFETTO-247#1200#300.1400.417530SiC MOSFET 1200V/30A TO-247; e.g. C2M0080120D; Ron at Tj=25C Vgs=20V80TO-2472501,200
SiC_MOSFETTO-247#1200#720.1400.1717572SiC MOSFET 1200V/72A TO-247-4pin; Wolfspeed top-tier; Ron Tj=25C Vgs=20V18TO-2476251,200
SiC_MOSFETTO-247#1700#300.1400.4517530SiC MOSFET 1700V/30A TO-247; high-blocking rail; utility-scale converters160TO-2472221,700

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