Wire Bonding Parameters: ball_bond_copper
Semiconductor wire bonding process parameters — bond pad pitch, wire diameter, loop height, pull strength, ball shear strength, bonding temperature, ultrasonic frequency/power, bonding force, and wire mechanical properties by bond type and wire material. Covers ball bonding (Au, Cu, Pd-coated Cu), wedge bonding (Al, Au), ribbon bonding (Au and Al ribbon), and heavy-wire aluminum bonding for power modules. Minimum strength values per MIL-STD-883 Method 2011 and JEDEC JESD22-B116.
| bond type | record id | ball shear min gf (gf) | ball shear typical gf (gf) | ball to pad diameter ratio max (dimensionless) | ball to pad diameter ratio min (dimensionless) | bond pad pitch min um (um) | bond temp max C (C) | bond temp min C (C) | bond temp substrate C | bond time ms (ms) | bonding force gf (gf) | loop height max um (um) | loop height min um (um) | notes | pull strength min gf (gf) | pull strength typical gf (gf) | ultrasonic freq kHz (kHz) | ultrasonic power mW (mW) | wire diameter mil (mil) | wire diameter um (um) | wire elongation pct (pct) | wire material | wire tensile strength gf (gf) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ball_bond_copper | bb_cu_18um | 9 | 15 | 3.5 | 2.3 | 35 | 230 | 170 | 200 | 8 | 25 | 300 | 75 | 18um Cu; thermosonic; forming gas (95N2/5H2) FAB atmosphere required to prevent oxidation; harder than Au — requires calibrated force | 3.5 | 5.5 | 120 | 40 | 0.7 | 18 | 4 | copper | 7.5 |
| ball_bond_copper | bb_cu_25um | 15 | 26 | 3.5 | 2.5 | 45 | 230 | 170 | 200 | 10 | 35 | 350 | 75 | 25um Cu; lowest-resistance fine-pitch option; forming gas sheath required at FAB; Pd-Cu and Ag-Cu alloy variants exist | 5 | 8 | 120 | 60 | 1 | 25 | 4 | copper | 13 |
| ball_bond_copper | bb_cu_38um | 33 | 55 | 3.5 | 2.5 | 75 | 230 | 170 | 200 | 12 | 50 | 450 | 100 | 38um Cu; higher current density; IMC formation faster than Au; requires tighter pad metallization control (Al pad preferred) | 8.5 | 13 | 120 | 80 | 1.5 | 38 | 4 | copper | 27 |
This is a sample. Search the full wire bonding parameters dataset and 300+ more by creating a free account and accessing the database.
Get started for FREE