Solder Alloy Properties: SnPb

Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.

Electrical Engineeringsolder_family: SnPb3 rows
solder familyalloy designationalloy categorycomposition nominalcte ppm per C (ppm/K)density g cc (g/cm3)elastic modulus GPa (GPa)electrical resistivity uOhm cm (uOhm-cm)elongation pct (%)fatigue life cycles min (cycles)fatigue life cycles typical (cycles)hardness HB (HB)ipc alloy classliquidus C (degC)notesrohs compliantshear strength MPa (MPa)solidus C (degC)tensile strength MPa (MPa)thermal conductivity W mK (W/mK)wettability
SnPbSn10Pb90high_lead10Sn-90Pb27.910.51918308001,2008J-STD-006 Class 0302High-lead alloy for step soldering; high melting point; exempted from RoHS for specific semiconductor die attach applicationsno172683035.8fair
SnPbSn5Pb95high_lead5Sn-95Pb28.410.818.519.6456001,0008J-STD-006 Class 0312High-lead (95Pb) alloy; used for flip-chip C4 bumps and die attach (RoHS exempt); high melting point limits thermal stress on substrateno143082835.2fair
SnPbSn60Pb40near_eutectic_leaded60Sn-40Pb23.98.53015.3401,2002,00016J-STD-006 Class 0191Near-eutectic Sn-Pb; slightly wider plastic range than eutectic; good wettability and reworkno351835249excellent

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