Solder Alloy Properties: SnPb
Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.
| solder family | alloy designation | alloy category | composition nominal | cte ppm per C (ppm/K) | density g cc (g/cm3) | elastic modulus GPa (GPa) | electrical resistivity uOhm cm (uOhm-cm) | elongation pct (%) | fatigue life cycles min (cycles) | fatigue life cycles typical (cycles) | hardness HB (HB) | ipc alloy class | liquidus C (degC) | notes | rohs compliant | shear strength MPa (MPa) | solidus C (degC) | tensile strength MPa (MPa) | thermal conductivity W mK (W/mK) | wettability |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SnPb | Sn10Pb90 | high_lead | 10Sn-90Pb | 27.9 | 10.5 | 19 | 18 | 30 | 800 | 1,200 | 8 | J-STD-006 Class 0 | 302 | High-lead alloy for step soldering; high melting point; exempted from RoHS for specific semiconductor die attach applications | no | 17 | 268 | 30 | 35.8 | fair |
| SnPb | Sn5Pb95 | high_lead | 5Sn-95Pb | 28.4 | 10.8 | 18.5 | 19.6 | 45 | 600 | 1,000 | 8 | J-STD-006 Class 0 | 312 | High-lead (95Pb) alloy; used for flip-chip C4 bumps and die attach (RoHS exempt); high melting point limits thermal stress on substrate | no | 14 | 308 | 28 | 35.2 | fair |
| SnPb | Sn60Pb40 | near_eutectic_leaded | 60Sn-40Pb | 23.9 | 8.5 | 30 | 15.3 | 40 | 1,200 | 2,000 | 16 | J-STD-006 Class 0 | 191 | Near-eutectic Sn-Pb; slightly wider plastic range than eutectic; good wettability and rework | no | 35 | 183 | 52 | 49 | excellent |
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