Solder Alloy Properties
Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.
Attributes
alloy_category
solidus_CdegC
liquidus_CdegC
density_g_ccg/cm3
tensile_strength_MPaMPa
shear_strength_MPaMPa
elongation_pct%
elastic_modulus_GPaGPa
cte_ppm_per_Cppm/K
thermal_conductivity_W_mKW/mK
electrical_resistivity_uOhm_cmuOhm-cm
hardness_HBHB
fatigue_life_cycles_mincycles
fatigue_life_cycles_typicalcycles
wettability
rohs_compliant
ipc_alloy_class
composition_nominal
Browse data
Search the full solder alloy properties dataset with natural language or structured queries.
Search this table