Solder Alloy Properties: SnBi
Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.
| solder family | alloy designation | alloy category | composition nominal | cte ppm per C (ppm/K) | density g cc (g/cm3) | elastic modulus GPa (GPa) | electrical resistivity uOhm cm (uOhm-cm) | elongation pct (%) | fatigue life cycles min (cycles) | fatigue life cycles typical (cycles) | hardness HB (HB) | ipc alloy class | liquidus C (degC) | notes | rohs compliant | shear strength MPa (MPa) | solidus C (degC) | tensile strength MPa (MPa) | thermal conductivity W mK (W/mK) | wettability |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SnBi | Bi57Sn42Ag1 | low_temperature_modified | 42Sn-57Bi-1Ag | 15.5 | 8.5 | 43 | 37.5 | 48 | 700 | 1,200 | 24 | J-STD-006 Class 0 | 140 | Ag addition to BiSn eutectic improves ductility and reliability; reduces bismuth embrittlement vs binary BiSn; improved thermal cycling reliability; low-temp processing compatible | yes | 42 | 139 | 62 | 20 | good |
| SnBi | Bi58Sn42 | low_temperature_eutectic | 42Sn-58Bi | 15 | 8.56 | 41 | 38.3 | 55 | 500 | 900 | 23 | J-STD-006 Class 0 | 138 | Low-temperature eutectic; suitable for heat-sensitive components; brittle at room temp limits elongation; bismuth embrittlement risk with Pb contamination; not suited for high-stress applications | yes | 38 | 138 | 57 | 19 | good |
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