Solder Alloy Properties: SnBi

Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.

Electrical Engineeringsolder_family: SnBi2 rows
solder familyalloy designationalloy categorycomposition nominalcte ppm per C (ppm/K)density g cc (g/cm3)elastic modulus GPa (GPa)electrical resistivity uOhm cm (uOhm-cm)elongation pct (%)fatigue life cycles min (cycles)fatigue life cycles typical (cycles)hardness HB (HB)ipc alloy classliquidus C (degC)notesrohs compliantshear strength MPa (MPa)solidus C (degC)tensile strength MPa (MPa)thermal conductivity W mK (W/mK)wettability
SnBiBi57Sn42Ag1low_temperature_modified42Sn-57Bi-1Ag15.58.54337.5487001,20024J-STD-006 Class 0140Ag addition to BiSn eutectic improves ductility and reliability; reduces bismuth embrittlement vs binary BiSn; improved thermal cycling reliability; low-temp processing compatibleyes421396220good
SnBiBi58Sn42low_temperature_eutectic42Sn-58Bi158.564138.35550090023J-STD-006 Class 0138Low-temperature eutectic; suitable for heat-sensitive components; brittle at room temp limits elongation; bismuth embrittlement risk with Pb contamination; not suited for high-stress applicationsyes381385719good

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