Solder Alloy Properties: SnAg
Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.
| solder family | alloy designation | alloy category | composition nominal | cte ppm per C (ppm/K) | density g cc (g/cm3) | elastic modulus GPa (GPa) | electrical resistivity uOhm cm (uOhm-cm) | elongation pct (%) | fatigue life cycles min (cycles) | fatigue life cycles typical (cycles) | hardness HB (HB) | ipc alloy class | liquidus C (degC) | notes | rohs compliant | shear strength MPa (MPa) | solidus C (degC) | tensile strength MPa (MPa) | thermal conductivity W mK (W/mK) | wettability |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SnAg | SnAg3.5 | lead_free_tin_silver | 96.5Sn-3.5Ag | 22 | 7.37 | 55 | 12.3 | 35 | 2,000 | 3,200 | 15 | J-STD-006 Class 7 | 221 | Binary Sn-Ag eutectic; no Cu addition; good wettability; Ag3Sn strengthening; used in wave solder and flux-cored wire; melting point higher than SAC305 liquidus | yes | 38 | 221 | 58 | 55 | good |
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