Solder Alloy Properties: SAC

Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.

Electrical Engineeringsolder_family: SAC3 rows
solder familyalloy designationalloy categorycomposition nominalcte ppm per C (ppm/K)density g cc (g/cm3)elastic modulus GPa (GPa)electrical resistivity uOhm cm (uOhm-cm)elongation pct (%)fatigue life cycles min (cycles)fatigue life cycles typical (cycles)hardness HB (HB)ipc alloy classliquidus C (degC)notesrohs compliantshear strength MPa (MPa)solidus C (degC)tensile strength MPa (MPa)thermal conductivity W mK (W/mK)wettability
SACSAC105lead_free_low_silver98.5Sn-1.0Ag-0.5Cu227.324813.3131,4002,20013J-STD-006 Class 7227Low-silver SAC; reduced cost vs SAC305; lower fatigue life; wider liquidus range than SAC305; suited for BGA spheres where lower cost is desired; melting range 215-227°Cyes262154060good
SACSAC305lead_free_standard96.5Sn-3.0Ag-0.5Cu217.385113.2191,8003,00015J-STD-006 Class 7220Industry-standard lead-free alloy; recommended by IPC and JEDEC as primary Pb-free replacement; fine Ag3Sn and Cu6Sn5 precipitates strengthen matrix; thermal cycling data per JEDEC JESD22-A104yes322175059good
SACSAC405lead_free_high_silver95.5Sn-4.0Ag-0.5Cu20.57.445213.2172,2003,80015J-STD-006 Class 7220Higher Ag content than SAC305; superior fatigue life in aggressive thermal cycling (-40/125°C); ~50% more reliable than SN100C per CALCE/UMD; higher cost due to Ag; tensile UTS approx 53 MPayes352175362good

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