Solder Alloy Properties: SnCu
Mechanical, thermal, and fatigue properties of electronic solder alloys — covers Sn63Pb37 (eutectic), Sn60Pb40, SAC305, SAC405, SAC105, SN100C (Sn-Cu-Ni-Ge), Bi58Sn42 low-temperature eutectic, Bi57Sn42Ag1, SnAg3.5, Sn5Pb95 and Sn10Pb90 high-lead, and Au80Sn20. Properties include solidus/liquidus temperatures, tensile strength, shear strength, elongation, elastic modulus, coefficient of thermal expansion, thermal conductivity, electrical resistivity, hardness, thermal fatigue life (cycles at -40 to 125°C), wettability, and RoHS compliance per IPC J-STD-006C.
| solder family | alloy designation | alloy category | composition nominal | cte ppm per C (ppm/K) | density g cc (g/cm3) | elastic modulus GPa (GPa) | electrical resistivity uOhm cm (uOhm-cm) | elongation pct (%) | fatigue life cycles min (cycles) | fatigue life cycles typical (cycles) | hardness HB (HB) | ipc alloy class | liquidus C (degC) | notes | rohs compliant | shear strength MPa (MPa) | solidus C (degC) | tensile strength MPa (MPa) | thermal conductivity W mK (W/mK) | wettability |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SnCu | SN100C | lead_free_tin_copper | 99.3Sn-0.7Cu-0.05Ni-Ge | 22.5 | 7.3 | 45 | 14 | 18 | 1,000 | 1,700 | 12 | J-STD-006 Class 7 | 228 | Nihon Superior SN100C; Ni refines grain structure and improves joint appearance; Ge acts as antioxidant; economical (no Ag); wave solder and selective solder applications; 0-Ag formulation | yes | 22 | 227 | 35 | 63 | good |
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