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Adhesive Bond Strength: epoxy

structural high strength to underfill electronics

Adhesive bond strength data — lap shear strength, peel strength, service temperature, cure conditions, and substrate compatibility by adhesive type and variant. Covers epoxy, acrylic (methacrylate, cyanoacrylate), polyurethane, silicone (RTV, structural glazing), anaerobic (threadlocker, retaining, gasket), and phenolic/modified phenolic adhesive systems.

Materials Scienceadhesive category: epoxy4 rowsPage 2 of 2
adhesive categoryadhesive variantadhesive familycure temp F (F)cure time at cure temp hr (hr)elongation at break pct (%)full cure days (days)gap fill max in (in)hardness shore d (Shore D)lap shear strength max psi (psi)lap shear strength min psi (psi)lap shear strength typical psi (psi)lap shear strength unitmix ratio by weightopen time min (min)peel strength max pli (lbf/in)peel strength min pli (lbf/in)peel strength typical pli (lbf/in)peel strength unitservice temp max F (F)service temp min F (F)substrate groupviscosity cp (cP)
epoxystructural high strengthepoxy7748570.01857,5004,0005,500psi1:1201236pli300-67metal50,000
epoxytoughened flexibleepoxy77241570.03705,5002,5003,800psi2:145401020pli250-40metal20,000
epoxytwo part fast cureepoxy771530.015785,0002,5003,500psi1:1151025pli200-40metal5,000
epoxyunderfill electronicsepoxy3020.0830.0029010,0006,0008,000psi1:0250-65silicon5,000

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