Adhesive Bond Strength: silicone
Adhesive bond strength data — lap shear strength, peel strength, service temperature, cure conditions, and substrate compatibility by adhesive type and variant. Covers epoxy, acrylic (methacrylate, cyanoacrylate), polyurethane, silicone (RTV, structural glazing), anaerobic (threadlocker, retaining, gasket), and phenolic/modified phenolic adhesive systems.
| adhesive category | adhesive variant | adhesive family | cure temp F (F) | cure time at cure temp hr (hr) | elongation at break pct (%) | gap fill max in (in) | hardness shore d (Shore D) | lap shear strength max psi (psi) | lap shear strength min psi (psi) | lap shear strength typical psi (psi) | lap shear strength unit | mix ratio by weight | notes | peel strength max pli (lbf/in) | peel strength min pli (lbf/in) | peel strength typical pli (lbf/in) | peel strength unit | service temp max F (F) | service temp min F (F) | substrate group | viscosity cp (cP) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| silicone | high_consistency_rubber | silicone | 325 | 0.25 | 3 | 0.1 | 50 | 400 | 100 | 200 | psi | 1:0 | HCR silicone rubber; requires milling and platinum cure; outstanding thermal range; for gaskets and seals with bonded substrates | 30 | 5 | 15 | pli | 500 | -100 | textile | 1,000,000 |
| silicone | led_dam_and_fill | silicone | 302 | 0.5 | 200 | 1 | 25 | 180 | 50 | 100 | psi | 1:1 | Silicone LED encapsulant; high transmittance >99% at 400-700nm; low shrinkage; thermal stability to 300°C; refractive index 1.41-1.54 | 12 | 2 | 5 | pli | 302 | -65 | silicon | 50,000 |
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