Adhesive Bond Strength: epoxy
Adhesive bond strength data — lap shear strength, peel strength, service temperature, cure conditions, and substrate compatibility by adhesive type and variant. Covers epoxy, acrylic (methacrylate, cyanoacrylate), polyurethane, silicone (RTV, structural glazing), anaerobic (threadlocker, retaining, gasket), and phenolic/modified phenolic adhesive systems.
| adhesive category | adhesive variant | adhesive family | cure temp F (F) | cure time at cure temp hr (hr) | elongation at break pct (%) | full cure days (days) | gap fill max in (in) | hardness shore d (Shore D) | lap shear strength max psi (psi) | lap shear strength min psi (psi) | lap shear strength typical psi (psi) | lap shear strength unit | mix ratio by weight | notes | open time min (min) | peel strength max pli (lbf/in) | peel strength min pli (lbf/in) | peel strength typical pli (lbf/in) | peel strength unit | service temp max F (F) | service temp min F (F) | substrate group | viscosity cp (cP) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| epoxy | conductive_silver | epoxy | 302 | 0.5 | 2 | 1 | 0.005 | 78 | 6,500 | 3,000 | 4,500 | psi | 1:1 | Silver-filled electrically conductive epoxy; volume resistivity < 0.001 ohm-cm; die attach and grounding bonds; cure 150°C 30 min | 10 | 5 | 1 | 2 | pli | 302 | -65 | silicon | 10,000 |
| epoxy | cryogenic_grade | epoxy | 77 | 24 | 8 | 7 | 0.01 | 82 | 7,000 | 3,500 | 5,000 | psi | 1:1 | Cryogenic service epoxy; qualified for LN2/LOX service; low outgassing < 1% TML; Stycast 2850FT class; CTE-matched fills available | 20 | 25 | 6 | 12 | pli | 200 | -452 | metal | 15,000 |
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