Adhesive Bond Strength: phenolic

Adhesive bond strength data — lap shear strength, peel strength, service temperature, cure conditions, and substrate compatibility by adhesive type and variant. Covers epoxy, acrylic (methacrylate, cyanoacrylate), polyurethane, silicone (RTV, structural glazing), anaerobic (threadlocker, retaining, gasket), and phenolic/modified phenolic adhesive systems.

Materials Scienceadhesive_category: phenolic3 rows
adhesive categoryadhesive variantadhesive familycure temp F (F)cure time at cure temp hr (hr)elongation at break pct (%)gap fill max in (in)hardness shore d (Shore D)lap shear strength max psi (psi)lap shear strength min psi (psi)lap shear strength typical psi (psi)lap shear strength unitmix ratio by weightnotespeel strength max pli (lbf/in)peel strength min pli (lbf/in)peel strength typical pli (lbf/in)peel strength unitservice temp max F (F)service temp min F (F)substrate group
phenolicmodified_phenolic_epoxyphenolic350130.01756,0003,0004,500psi1:0Epoxy-phenolic; high temperature structural bonds; printed circuit board lamination; better elongation than pure phenolic30815pli300-65metal
phenolicmodified_phenolic_nitrilephenolic250130.01705,0002,5003,500psi1:0Nitrile-phenolic; combines toughness of nitrile with phenolic heat resistance; metal-to-metal aerospace bonds; 250-350°F cure25512pli250-65metal
phenolicmodified_phenolic_vinylphenolic300130.01725,5002,8004,000psi1:0Vinyl-phenolic; excellent metal bonding; Bloomingdale and Redux 775 class; used in metal-to-metal aerospace structure351018pli250-65metal

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