Adhesive Bond Strength: phenolic
Adhesive bond strength data — lap shear strength, peel strength, service temperature, cure conditions, and substrate compatibility by adhesive type and variant. Covers epoxy, acrylic (methacrylate, cyanoacrylate), polyurethane, silicone (RTV, structural glazing), anaerobic (threadlocker, retaining, gasket), and phenolic/modified phenolic adhesive systems.
| adhesive category | adhesive variant | adhesive family | cure temp F (F) | cure time at cure temp hr (hr) | elongation at break pct (%) | gap fill max in (in) | hardness shore d (Shore D) | lap shear strength max psi (psi) | lap shear strength min psi (psi) | lap shear strength typical psi (psi) | lap shear strength unit | mix ratio by weight | notes | peel strength max pli (lbf/in) | peel strength min pli (lbf/in) | peel strength typical pli (lbf/in) | peel strength unit | service temp max F (F) | service temp min F (F) | substrate group |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| phenolic | modified_phenolic_epoxy | phenolic | 350 | 1 | 3 | 0.01 | 75 | 6,000 | 3,000 | 4,500 | psi | 1:0 | Epoxy-phenolic; high temperature structural bonds; printed circuit board lamination; better elongation than pure phenolic | 30 | 8 | 15 | pli | 300 | -65 | metal |
| phenolic | modified_phenolic_nitrile | phenolic | 250 | 1 | 3 | 0.01 | 70 | 5,000 | 2,500 | 3,500 | psi | 1:0 | Nitrile-phenolic; combines toughness of nitrile with phenolic heat resistance; metal-to-metal aerospace bonds; 250-350°F cure | 25 | 5 | 12 | pli | 250 | -65 | metal |
| phenolic | modified_phenolic_vinyl | phenolic | 300 | 1 | 3 | 0.01 | 72 | 5,500 | 2,800 | 4,000 | psi | 1:0 | Vinyl-phenolic; excellent metal bonding; Bloomingdale and Redux 775 class; used in metal-to-metal aerospace structure | 35 | 10 | 18 | pli | 250 | -65 | metal |
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