Thermal Contact Resistance: ss_al_moderate_20MPa to steel_al_milled_30MPa
Thermal contact resistance and conductance for material interfaces — bolted joints, pressed contacts, greased interfaces, thermal pads, solder/epoxy bonds, bare metal-to-metal contacts, and Kapitza (phonon boundary) resistance for crystalline interfaces
| contact id | conductance W m2K (W/m2K) | contact pressure MPa (MPa) | contact resistance m2KW (m2K/W) | environment | interface material | material 1 | material 2 | surface finish | temperature C (C) |
|---|---|---|---|---|---|---|---|---|---|
| ss_al_moderate_20MPa | 3,600 | 20 | 0.000278 | air | none | stainless_steel | aluminum | as-machined | 20 |
| ss_ss_indium_3p5MPa | 250,000 | 3.5 | 0.000004 | air | indium_foil | stainless_steel | stainless_steel | ground | 20 |
| ss_ss_vacuum_0p1MPa | 645 | 0.1 | 0.00155 | vacuum | none | stainless_steel | stainless_steel | ground | 20 |
| steel_al_ground_10MPa | 50,000 | 10 | 0.00002 | air | none | carbon_steel | aluminum | ground | 20 |
| steel_al_milled_30MPa | 8,300 | 30 | 0.00012 | air | none | carbon_steel | aluminum | milled | 20 |
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