Thermal Contact Resistance: al2o3_al_boundary to al_al_pb_coating
Thermal contact resistance and conductance for material interfaces — bolted joints, pressed contacts, greased interfaces, thermal pads, solder/epoxy bonds, bare metal-to-metal contacts, and Kapitza (phonon boundary) resistance for crystalline interfaces
| contact id | conductance W m2K (W/m2K) | contact pressure MPa (MPa) | contact resistance m2KW (m2K/W) | environment | interface material | material 1 | material 2 | surface finish | temperature C (C) |
|---|---|---|---|---|---|---|---|---|---|
| al2o3_al_boundary | 1,052,632 | — | 0.000001 | air | none | aluminum_oxide | aluminum | polished | 20 |
| al_al_bolted_M8 | 5,000 | 1 | 0.0002 | air | none | aluminum | aluminum | as-machined | 20 |
| al_al_grease_hiperf_1MPa | 20,000 | 1 | 0.00005 | air | high_performance_thermal_grease | aluminum | aluminum | ground | 25 |
| al_al_indium_0p1MPa | 142,857 | 0.1 | 0.000007 | air | indium_foil | aluminum | aluminum | ground | 20 |
| al_al_pb_coating | 181,818 | — | 0.000006 | air | lead_coating | aluminum | aluminum | ground | 20 |
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