Thermal Contact Resistance: cu_cu_milled_3MPa to si_al_lapped_air_0p1MPa
Thermal contact resistance and conductance for material interfaces — bolted joints, pressed contacts, greased interfaces, thermal pads, solder/epoxy bonds, bare metal-to-metal contacts, and Kapitza (phonon boundary) resistance for crystalline interfaces
| contact id | conductance W m2K (W/m2K) | contact pressure MPa (MPa) | contact resistance m2KW (m2K/W) | environment | interface material | material 1 | material 2 | surface finish | temperature C (C) |
|---|---|---|---|---|---|---|---|---|---|
| cu_cu_milled_3MPa | 55,500 | 3 | 0.000018 | air | none | copper | copper | milled | 20 |
| cu_cu_vacuum_10MPa | 33,333 | 10 | 0.00003 | vacuum | none | copper | copper | ground | 20 |
| mg_mg_vacuum_0p1MPa | 4,000 | 0.1 | 0.00025 | vacuum | none | magnesium | magnesium | ground | 20 |
| si_al_lapped_air_0p1MPa | 22,222 | 0.1 | 0.000045 | air | none | silicon | aluminum | lapped | 27 |
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