Heat Sink Specs: vapor_chamber
Heat sink thermal resistance and performance specifications for electronics cooling — 7 heat sink types (extruded aluminum, bonded fin, folded fin, pin fin, stamped, vapor chamber, active fan sink) from 25×25mm to 150×150mm; thermal resistance at natural convection, 200 LFM, and 400 LFM forced air; fin dimensions, weight, surface area, max power dissipation
| heat sink type | heat sink id | height mm (mm) | length mm (mm) | material | max power dissipation W at 40C rise (W) | surface area cm2 (cm2) | thermal resistance 200LFM C per W (degC/W) | thermal resistance 400LFM C per W (degC/W) | thermal resistance natural C per W (degC/W) | weight g (g) | width mm (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| vapor_chamber | VC-100X100 | 10 | 100 | copper_aluminum | 160 | 200 | 0.14 | 0.09 | 0.25 | 520 | 100 |
| vapor_chamber | VC-60X60 | 8 | 60 | copper_aluminum | 80 | 72 | 0.28 | 0.19 | 0.5 | 180 | 60 |
| vapor_chamber | VC-80X80 | 8 | 80 | copper_aluminum | 114.3 | 128 | 0.2 | 0.13 | 0.35 | 310 | 80 |
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