Heat Sink Specs: stamped
Heat sink thermal resistance and performance specifications for electronics cooling — 7 heat sink types (extruded aluminum, bonded fin, folded fin, pin fin, stamped, vapor chamber, active fan sink) from 25×25mm to 150×150mm; thermal resistance at natural convection, 200 LFM, and 400 LFM forced air; fin dimensions, weight, surface area, max power dissipation
| heat sink type | heat sink id | base thickness mm (mm) | fin pitch mm (mm) | height mm (mm) | length mm (mm) | material | max power dissipation W at 40C rise (W) | num fins (count) | surface area cm2 (cm2) | thermal resistance 200LFM C per W (degC/W) | thermal resistance 400LFM C per W (degC/W) | thermal resistance natural C per W (degC/W) | weight g (g) | width mm (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| stamped | ST-35X15 | 1.5 | 5 | 15 | 35 | aluminum_1100 | 0.6 | 6 | 22 | 32 | 22 | 65 | 8 | 35 |
| stamped | ST-50X20 | 1.5 | 6.5 | 20 | 50 | aluminum_1100 | 1.1 | 7 | 42 | 17 | 11.5 | 35 | 18 | 50 |
| stamped | ST-70X25 | 2 | 8 | 25 | 70 | aluminum_1100 | 2 | 8 | 80 | 10 | 6.5 | 20 | 40 | 70 |
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