Heat Sink Specs: bonded_fin
Heat sink thermal resistance and performance specifications for electronics cooling — 7 heat sink types (extruded aluminum, bonded fin, folded fin, pin fin, stamped, vapor chamber, active fan sink) from 25×25mm to 150×150mm; thermal resistance at natural convection, 200 LFM, and 400 LFM forced air; fin dimensions, weight, surface area, max power dissipation
| heat sink type | heat sink id | base thickness mm (mm) | fin pitch mm (mm) | height mm (mm) | length mm (mm) | material | max power dissipation W at 40C rise (W) | num fins (count) | surface area cm2 (cm2) | thermal resistance 200LFM C per W (degC/W) | thermal resistance 400LFM C per W (degC/W) | thermal resistance natural C per W (degC/W) | weight g (g) | width mm (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| bonded_fin | BF-100X50 | 5 | 2.8 | 50 | 100 | aluminum_6063 | 11.4 | 32 | 580 | 1.8 | 1.2 | 3.5 | 290 | 100 |
| bonded_fin | BF-100X75 | 5 | 2.8 | 75 | 100 | aluminum_6063 | 16 | 32 | 820 | 1.3 | 0.85 | 2.5 | 400 | 100 |
| bonded_fin | BF-150X75 | 6 | 2.8 | 75 | 150 | aluminum_6063 | 25 | 48 | 1,650 | 0.82 | 0.54 | 1.6 | 850 | 150 |
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