Heat Pipe Performance: vapor_chamber
Heat pipe performance data — cylindrical, vapor chamber, loop, micro, and thermosyphon types with various working fluids and wick structures
| heat pipe type | sk | application | effective conductivity WmK max (W/mK) | effective conductivity WmK min (W/mK) | max heat flux Wcm2 (W/cm2) | notes | operating temp high C (C) | operating temp low C (C) | orientation effect | thermal resistance CW max (C/W) | thermal resistance CW min (C/W) | wick type | working fluid |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| vapor_chamber | water#sintered#flat | GPU cooling, CPU heat spreading, high-density electronics, smartphones | 50,000 | 10,000 | 500 | Flat two-phase device spreading heat in 2D; typical size 100x80mm for GPU applications; thermal resistance 0.05-0.15 C/W total device-to-ambient; max heat flux >500 W/cm2 for advanced designs; replaces heat spreader in high-end packages; copper sintered wick standard | 150 | 30 | negligible | 0.15 | 0.05 | sintered | water |
| vapor_chamber | water#sintered_foam#flat | server motherboards, power amplifier modules, LED arrays | 60,000 | 15,000 | 200 | Standard copper foam sintered vapor chamber for server/telecom; minimum thermal resistance ~0.09 K/W per copper foam VC study; 170-589 W/cm2 heat flux demonstrated in literature; replaces spreader plate with superior spreading | 150 | 30 | negligible | 0.28 | 0.09 | sintered_foam | water |
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