Heat Pipe Performance: micro_heat_pipe
Heat pipe performance data — cylindrical, vapor chamber, loop, micro, and thermosyphon types with various working fluids and wick structures
| heat pipe type | sk | application | diameter mm max | diameter mm min | effective conductivity WmK max (W/mK) | effective conductivity WmK min (W/mK) | length mm typical | max heat flux Wcm2 (W/cm2) | max heat transport Wm (Wm) | notes | operating temp high C (C) | operating temp low C (C) | orientation effect | thermal resistance CW max (C/W) | thermal resistance CW min (C/W) | wick type | working fluid |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| micro_heat_pipe | water#grooved_corner#0.5-3mm | chip-level cooling, silicon substrates, MEMS thermal management | 3 | 0.5 | 5,000 | 500 | 50 | 10 | 5 | Micro HP: hydraulic diameter <3mm; acute-angle grooves act as capillaries; integrated into silicon substrates via MEMS; 0.3mm thin LHP achieved 10 W/cm2 and Rth 2.51 K/W; effective conductivity 2438 W/mK for 0.3mm device; CNT-enhanced wicks reduce Rth 40% | 120 | 20 | moderate_sensitivity | 5 | 0.5 | grooved_corner | water |
| micro_heat_pipe | water#grooved_corner#1-3mm | mobile device cooling, smartphone SoC, tablet chips | 3 | 1 | 10,000 | 2,000 | 100 | 20 | 20 | Miniature heat pipe 1-3mm for smartphones/tablets; thin flat micro HP embedded in phone chassis; effective conductivity up to 20900 W/mK measured for ultra-thin vapor chambers in horizontal orientation; used in smartphone thermal management | 120 | 20 | moderate_sensitivity | 2 | 0.2 | grooved_corner | water |
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