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Datacenter Thermal Guidelines: IEEE 3003 2 Grounding

terminology gec to vd 500kcmil steel armor measured

ASHRAE TC9.9 thermal environment guidelines for datacenter equipment classes (A1-A4, B, C, HI air-cooled; W17-W45 liquid-cooled) — recommended and allowable operating envelopes for inlet dry-bulb temperature, humidity, dew point, elevation, and rate of change. Also includes IEEE 3003.2-2014 grounding electrode resistance, conductor impedance, shock voltage, and voltage drop data; IEEE 3003.1-2019 grounding method selection table; and IEEE 3004.11-2019 dual-tie bus differential protection fault scenarios.

Electrical Engineeringstandard class: IEEE 3003 2 Grounding10 rowsPage 2 of 2
standard classparameterallowable maxenvelopeunit
IEEE 3003 2 Groundingterminology gecreference
IEEE 3003 2 Groundingterminology ground busreference
IEEE 3003 2 Groundingterminology grounding electrodereference
IEEE 3003 2 Groundingterminology pen conductorreference
IEEE 3003 2 Groundingvd 2awg 1 25in rigid steel computed10.8referenceV/kA/100ft
IEEE 3003 2 Groundingvd 2awg emt computed20.5referenceV/kA/100ft
IEEE 3003 2 Groundingvd 2awg flexible conduit computed435referenceV/kA/100ft
IEEE 3003 2 Groundingvd 500kcmil steel armor computed38.3referenceV/kA/100ft
IEEE 3003 2 Groundingvd 500kcmil steel armor int pe measured5referenceV/kA/100ft
IEEE 3003 2 Groundingvd 500kcmil steel armor measured35referenceV/kA/100ft

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