Datacenter Thermal Guidelines: IEEE_3003_2_Grounding
ASHRAE TC9.9 thermal environment guidelines for datacenter equipment classes (A1-A4, B, C, HI air-cooled; W17-W45 liquid-cooled) — recommended and allowable operating envelopes for inlet dry-bulb temperature, humidity, dew point, elevation, and rate of change. Also includes IEEE 3003.2-2014 grounding electrode resistance, conductor impedance, shock voltage, and voltage drop data; IEEE 3003.1-2019 grounding method selection table; and IEEE 3004.11-2019 dual-tie bus differential protection fault scenarios.
| standard class | parameter | allowable max | envelope | unit |
|---|---|---|---|---|
| IEEE_3003_2_Grounding | ground_electrode_resistance_pct_at_3m | 94 | operating | pct |
| IEEE_3003_2_Grounding | ground_electrode_resistance_pct_at_4_6m | 97 | operating | pct |
| IEEE_3003_2_Grounding | ground_electrode_resistance_pct_at_6_1m | 99 | operating | pct |
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