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Home/Compare/Polymer/Polyimide (Thermoplastic PI Vespel SP-1) vs POM Copolymer (Acetal Copolymer Celcon/Hostaform)

Polyimide (Thermoplastic PI Vespel SP-1) vs POM Copolymer (Acetal Copolymer Celcon/Hostaform)

Property comparison of Polyimide (Thermoplastic PI Vespel SP-1) and POM Copolymer (Acetal Copolymer Celcon/Hostaform), both polymer.

Polymer7 compared properties
PropertyPolyimide (Thermoplastic PI Vespel SP-1)POM Copolymer (Acetal Copolymer Celcon/Hostaform)Difference
Tensile strength86 MPa62 MPa-28%
Elongation8 %35 %+338%
Poisson ratio0.410.35-15%
Density1,430 kg/m³1,410 kg/m³-1%
Thermal conductivity0.52 W/m·K0.35 W/m·K-33%
Specific heat1,130 J/kg·K1,460 J/kg·K+29%
Coefficient of thermal expansion0.000054 1/K0.0001 1/K+85%

Difference is POM Copolymer (Acetal Copolymer Celcon/Hostaform) relative to Polyimide (Thermoplastic PI Vespel SP-1). Values are taken from the representative row of each material; both materials may have multiple heat treatments or conditions on their individual pages.

Identification

Polyimide (Thermoplastic PI Vespel SP-1)
standard
ASTM
POM Copolymer (Acetal Copolymer Celcon/Hostaform)
standard
ASTM

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