Polyimide (Thermoplastic PI Vespel SP-1) vs POM Copolymer (Acetal Copolymer Celcon/Hostaform)
Property comparison of Polyimide (Thermoplastic PI Vespel SP-1) and POM Copolymer (Acetal Copolymer Celcon/Hostaform), both polymer.
| Property | Polyimide (Thermoplastic PI Vespel SP-1) | POM Copolymer (Acetal Copolymer Celcon/Hostaform) | Difference |
|---|---|---|---|
| Tensile strength | 86 MPa | 62 MPa | -28% |
| Elongation | 8 % | 35 % | +338% |
| Poisson ratio | 0.41 | 0.35 | -15% |
| Density | 1,430 kg/m³ | 1,410 kg/m³ | -1% |
| Thermal conductivity | 0.52 W/m·K | 0.35 W/m·K | -33% |
| Specific heat | 1,130 J/kg·K | 1,460 J/kg·K | +29% |
| Coefficient of thermal expansion | 0.000054 1/K | 0.0001 1/K | +85% |
Difference is POM Copolymer (Acetal Copolymer Celcon/Hostaform) relative to Polyimide (Thermoplastic PI Vespel SP-1). Values are taken from the representative row of each material; both materials may have multiple heat treatments or conditions on their individual pages.
Identification
- standard
- ASTM
- standard
- ASTM
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