Phenolic Thermoset (Bakelite GP-20 type molding compound) vs Polyimide (Thermoplastic PI Vespel SP-1)
Property comparison of Phenolic Thermoset (Bakelite GP-20 type molding compound) and Polyimide (Thermoplastic PI Vespel SP-1), both polymer.
| Property | Phenolic Thermoset (Bakelite GP-20 type molding compound) | Polyimide (Thermoplastic PI Vespel SP-1) | Difference |
|---|---|---|---|
| Tensile strength | 55 MPa | 86 MPa | +56% |
| Elongation | 1 % | 8 % | +700% |
| Poisson ratio | 0.35 | 0.41 | +17% |
| Density | 1,350 kg/m³ | 1,430 kg/m³ | +6% |
| Specific heat | 1,600 J/kg·K | 1,130 J/kg·K | -29% |
| Coefficient of thermal expansion | 0.000017 1/K | 0.000054 1/K | +218% |
Difference is Polyimide (Thermoplastic PI Vespel SP-1) relative to Phenolic Thermoset (Bakelite GP-20 type molding compound). Values are taken from the representative row of each material; both materials may have multiple heat treatments or conditions on their individual pages.
Identification
- standard
- ASTM
- standard
- ASTM
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