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Thermal Contact Resistance: al al indium 0p1MPa
Thermal contact resistance and conductance for material interfaces — bolted joints, pressed contacts, greased interfaces, thermal pads, solder/epoxy bonds, bare metal-to-metal contacts, and Kapitza (phonon boundary) resistance for crystalline interfaces
| contact id | conductance W m2K (W/m2K) | contact pressure MPa (MPa) | contact resistance m2KW (m2K/W) | environment | interface material | material 1 | material 2 | surface finish | temperature C (C) |
|---|---|---|---|---|---|---|---|---|---|
| al al indium 0p1MPa | 142,857 | 0.1 | 0.000007 | air | indium foil | aluminum | aluminum | ground | 20 |
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