Injection Molding Process Data: ABS to PA6 (Nylon 6)
Injection molding process parameters for thermoplastics — melt temperature, mold temperature, injection pressure, drying conditions, shrinkage, and wall thickness guidelines
| material | draft angle deg (deg) | drying required | drying temp C (degC) | drying time hr (hr) | injection pressure typical MPa (MPa) | material family | max wall thickness mm (mm) | melt temp max C (degC) | melt temp min C (degC) | min wall thickness mm (mm) | mold shrinkage pct max (%) | mold shrinkage pct min (%) | mold temp max C (degC) | mold temp min C (degC) | notes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ABS | 2 | Yes | 80 | 2 | 100 | styrenics | 6 | 260 | 200 | 0.8 | 0.8 | 0.4 | 70 | 25 | Hygroscopic; requires drying; good surface finish; paintable; electroplateable |
| PMMA (Acrylic) | 2 | Yes | 80 | 4 | 120 | styrenics | 6 | 250 | 200 | 0.8 | 0.6 | 0.3 | 80 | 50 | Optical clarity; requires polished mold; moisture sensitive; low chemical resistance |
| PC (Polycarbonate) | 1.5 | Yes | 120 | 4 | 120 | amorphous_engineering | 6 | 320 | 270 | 1 | 0.7 | 0.5 | 120 | 70 | Very hygroscopic; high melt temp needed; excellent impact and optical clarity; prone to residual stress |
| PC/ABS blend | 2 | Yes | 90 | 3 | 110 | amorphous_engineering | 6 | 280 | 230 | 0.8 | 0.7 | 0.5 | 90 | 50 | Balance of PC toughness and ABS processability; widely used in automotive/electronics |
| PA6 (Nylon 6) | 1 | Yes | 80 | 4 | 100 | semicrystalline_engineering | 6 | 280 | 230 | 0.8 | 1.5 | 0.8 | 80 | 60 | Hygroscopic; dimensional changes with moisture absorption; good chemical resistance |
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