Datacenter Thermal Guidelines: IEEE_3004_11_Bus_Protection
ASHRAE TC9.9 thermal environment guidelines for datacenter equipment classes (A1-A4, B, C, HI air-cooled; W17-W45 liquid-cooled) — recommended and allowable operating envelopes for inlet dry-bulb temperature, humidity, dew point, elevation, and rate of change. Also includes IEEE 3003.2-2014 grounding electrode resistance, conductor impedance, shock voltage, and voltage drop data; IEEE 3003.1-2019 grounding method selection table; and IEEE 3004.11-2019 dual-tie bus differential protection fault scenarios.
| standard class | parameter | envelope |
|---|---|---|
| IEEE_3004_11_Bus_Protection | config_2cts_around_tie_near_fault4 | reference |
| IEEE_3004_11_Bus_Protection | config_2cts_between_ties_fault1 | reference |
| IEEE_3004_11_Bus_Protection | config_2cts_between_ties_fault2 | reference |
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