Pure Aluminum (Al 99.99%) vs Pure Copper (Cu 99.95+ OFHC)
Property comparison of Pure Aluminum (Al 99.99%) and Pure Copper (Cu 99.95+ OFHC), both pure metal.
| Property | Pure Aluminum (Al 99.99%) | Pure Copper (Cu 99.95+ OFHC) | Difference |
|---|---|---|---|
| Yield strength | 10 MPa | 68 MPa | +580% |
| Tensile strength | 45 MPa | 220 MPa | +389% |
| Elongation | 50 % | 45 % | -10% |
| Elastic modulus | 69,000 MPa | 130,000 MPa | +88% |
| Poisson ratio | 0.33 | 0.34 | +3% |
| Density | 2,700 kg/m³ | 8,960 kg/m³ | +232% |
| Brinell hardness | 20 HB | 40 HB | +100% |
| Thermal conductivity | 235 W/m·K | 401 W/m·K | +71% |
| Specific heat | 900 J/kg·K | 385 J/kg·K | -57% |
| Coefficient of thermal expansion | 0.000023 1/K | 0.000017 1/K | -26% |
| Melting point | 660 °C | 1,085 °C | +64% |
Difference is Pure Copper (Cu 99.95+ OFHC) relative to Pure Aluminum (Al 99.99%). Values are taken from the representative row of each material; both materials may have multiple heat treatments or conditions on their individual pages.
Identification
- grade
- 1199 / super-pure
- standard
- CRC Handbook of Chemistry and Physics
- heat treatment
- annealed
- grade
- OFHC C10200
- standard
- CRC Handbook of Chemistry and Physics (MIT matprops database)
- heat treatment
- annealed
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